Packaging and lithography will set the ceiling on 2027 output.
Packaging and lithography will set the ceiling on 2027 output. See where capacity is tightening, which companies stand to gain, and why yield and qualification matter as much as new fab announcements. Annual growth in TSMC CoWoS and SoIC capacity, still short of demand EUV systems ASML delivers a year, capping advanced-node ramps Each topic draws on the 2027 Outlook reports. Bring your questions for the audience Q&A. TSMC's advanced packaging capacity will remain the bottleneck. CoWoS and SoIC capacity is projected to grow 20–25% annually, against rising demand from logic and from HBM, which also requires advanced packaging. Chiplet-based architectures with hybrid bonding, notably from AMD and Intel, will dominate highperformance computing by 2027. HBM4 introduces wider interfaces, taller stacks, custom logic dies and closer integration with accelerators. ASML's EUV tool delivery rate, around 30–40 systems a year, limits how many fabs can ramp advanced nodes at once. Fabs with secured EUV tool allocations will have decisive capacity advantages. China will help ease conventional DRAM and NAND supply, particularly for domestic and pricesensitive applications, but not the HBM wafer capacity AI needs most. CXMT's IPO and YMTC's NAND wafer bonding strengthen both companies' positions. 2027 Outlook Webinar Series: AI, Packaging, Manufacturing & Sustainability Register for three 2027 outlook webinars. Get the free Five Trends report now, plus every 2027 Outlook report as it publishes in the TechInsights Platform. Apple A20 Pro: Inside the iPhone 18 Pro’s TSMC 2nm Processor TechInsights analyzes Apple’s A20 Pro processor, revealing TSMC N2 gate-all-around technology, expanded AI and graphics processing, and a new side-by-side memory packaging architecture. Watch TechInsights unbox the Apple iPhone 18 Pro Max before our experts begin detailed teardown and semiconductor analysis. Discover why TechInsights stands as the semiconductor industry's most trusted source for actionable, in-depth intelligence. Copyright © 2026 TechInsights Inc. All rights reserved. Accessibility|Privacy Policy|Terms & Conditions|Conflict of Interest & Confidential Information|Ethics & Compliance